Michal Smola 2e22e8c1da dts: nxp mcxc: Add die temperature measurement ... Die temperature measurement is not configured in devicetree for NXP MCX C series. Add die temperature measurement configuration. Signed-off-by: Michal Smola <michal.smola@nxp.com>		2024-10-24 14:05:00 +02:00
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arc/synopsys	…
arm	dts: nxp mcxc: Add die temperature measurement	2024-10-24 14:05:00 +02:00
arm64	…
bindings	dts: bindings: vendor-prefixes: fix UP Bridge the Gap typo	2024-10-24 05:44:23 +01:00
common	dts: common: nordic: nrf54l20: Adjust RAM size to 511k	2024-10-16 16:33:48 +01:00
nios2/intel	dts: nios2: intel: Fix unit and first address mismatch	2024-09-18 15:30:24 +02:00
posix	…
riscv	dts: bindings: mbox: rename plic-sw to mbox-plic-sw	2024-10-23 16:53:13 +02:00
sparc/gaisler	…
x86/intel	…
xtensa	pm: s/power-domain/power-domains and add power-domain-names	2024-10-18 17:45:21 +01:00
Kconfig	…
binding-template.yaml	…