Usually, we want to operate only on "available" device
nodes ("available" means "status is okay and a matching binding is
found"), but that's not true in all cases.
Sometimes we want to operate on special nodes without matching
bindings, such as those describing memory.
To handle the distinction, change various additional devicetree APIs
making it clear that they operate only on available device nodes,
adjusting gen_defines and devicetree.h implementation details
accordingly:
- emit macros for all existing nodes in gen_defines.py, regardless
of status or matching binding
- rename DT_NUM_INST to DT_NUM_INST_STATUS_OKAY
- rename DT_NODE_HAS_COMPAT to DT_NODE_HAS_COMPAT_STATUS_OKAY
- rename DT_INST_FOREACH to DT_INST_FOREACH_STATUS_OKAY
- rename DT_ANY_INST_ON_BUS to DT_ANY_INST_ON_BUS_STATUS_OKAY
- rewrite DT_HAS_NODE_STATUS_OKAY in terms of a new DT_NODE_HAS_STATUS
- resurrect DT_HAS_NODE in the form of DT_NODE_EXISTS
- remove DT_COMPAT_ON_BUS as a public API
- use the new default_prop_types edtlib parameter
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
Make drivers multi-instance wherever possible using DT_INST_FOREACH.
This allows removing DT_HAS_DRV_INST in favor of making drivers just
do the right thing regardless of how many instances there are.
There are a few exceptions:
- SoC drivers which use CMake input files (like i2c_dw.c) or otherwise
would require more time to convert than I have at the moment. For the
sake of expediency, just inline the DT_HAS_DRV_INST expansion for
now in these cases.
- SoC drivers which are explicitly single-instance (like the nRF SAADC
driver). Again for the sake of expediency, drop a BUILD_ASSERT in
those cases to make sure the assumption that all supported SoCs have
at most one available instance is valid, failing fast otherwise.
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
Add an optional weighted average filter to the ADC readings in the NXP
Kinetis temperature sensor driver as recommended in NXP AN3031.
Signed-off-by: Henrik Brix Andersen <hebad@vestas.com>
Fix a potential 32 bit multiplication overflow (muliplying by 10000
instead of 1000000) and change the calculations and units accordingly.
Improve the code readability and traceability towards NXP AN3031 by
using the same variable name as in the application note.
Signed-off-by: Henrik Brix Andersen <hebad@vestas.com>
Replace all occurences of BUILD_ASSERT_MSG() with BUILD_ASSERT()
as a result of merging BUILD_ASSERT() and BUILD_ASSERT_MSG().
Signed-off-by: Oleg Zhurakivskyy <oleg.zhurakivskyy@intel.com>
This reverts commit 8739517107.
Pull Request #23437 was merged by mistake with an invalid manifest.
Signed-off-by: Carles Cufi <carles.cufi@nordicsemi.no>
Replace all occurences of BUILD_ASSERT_MSG() with BUILD_ASSERT()
as a result of merging BUILD_ASSERT() and BUILD_ASSERT_MSG().
Signed-off-by: Oleg Zhurakivskyy <oleg.zhurakivskyy@intel.com>
Add sensor driver for the internal temperature sensor present in the
NXP Kinetis SoC series.
The driver allows reading the die temperature and the voltage of the
external voltage reference used for calculating the temperature.
Signed-off-by: Henrik Brix Andersen <hebad@vestas.com>
Martí Bolívar