34 lines
1.2 KiB
Makefile
34 lines
1.2 KiB
Makefile
#
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# Makefile for sensor chip drivers.
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#
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obj-$(CONFIG_THERMAL) += thermal_sys.o
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thermal_sys-y += thermal_core.o
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# interface to/from other layers providing sensors
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thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o
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thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o
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# governors
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thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
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thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
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thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
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# cpufreq cooling
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thermal_sys-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
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# platform thermal drivers
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obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
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obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
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obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
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obj-y += samsung/
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obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
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obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
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obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
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obj-$(CONFIG_IMX_THERMAL) += imx_thermal.o
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obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o
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obj-$(CONFIG_X86_PKG_TEMP_THERMAL) += x86_pkg_temp_thermal.o
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obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/
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obj-$(CONFIG_ACPI_INT3403_THERMAL) += int3403_thermal.o
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